From May 13–15, 2025, the IoT Solutions World Congress (IOTSWC 2025) was held at the Gran Via Exhibition Centre in Barcelona, Spain. Under the theme "Connected Technologies for Tomorrow: Scaling Deployment, Accelerating Transformation," the event brought together more than 11,000 industry professionals from 110 countries and over 300 exhibiting companies. Participants explored the challenges and emerging technological applications associated with large-scale Internet of Things (IoT) deployment across sectors including industrial automation, energy, transportation, and healthcare.
As a specialized developer and manufacturer of magnetic components, Shinhom participated in the exhibition with a portfolio of proprietary products. Targeting IoT device manufacturers and system integrators, the company presented a range of customized magnetic component solutions designed for LoRaWAN gateways, AI edge computing devices, industrial sensors, and smart utility meters.
Large-Scale IoT Deployment: Emerging Challenges for Magnetic Components
One of the clearest messages emerging from IOTSWC 2025 was that the IoT industry has moved beyond pilot testing and entered a phase of mass deployment and large-scale implementation. According to data released during the event, the total number of connected IoT devices worldwide has surpassed 4.06 billion, while the installed base of LoRaWAN devices alone has exceeded 110 million units.
As deployment volumes continue to grow rapidly, hardware design engineers are increasingly encountering four critical challenges during mass-production development:
- Most IoT devices rely on battery power, requiring inductors and magnetic components with extremely low standby power consumption. Achieving both low power consumption and high conversion efficiency remains a significant engineering challenge.
- Multi-band RF architectures supporting Sub-GHz and 2.4 GHz communication have become standard practice, creating demand for miniaturized inductors capable of broadband impedance matching.
- Industrial equipment installed outdoors often operates under harsh environmental conditions, requiring components to maintain stable performance across a wide temperature range (-40°C to +85°C) and in environments with significant electromagnetic interference (EMI).
- The increasing power density of AI edge devices necessitates power magnetic components capable of handling higher output power within increasingly constrained PCB footprints.
Throughout the exhibition, companies ranging from LoRaWAN chipset supplier Semtech to gateway manufacturer Kerlink, smart metering provider Zenner, and telecommunications operator Swisscom emphasized that the quality of magnetic components directly affects overall system stability and reliability. This market demand aligns closely with Shinhom's product development strategy and technical capabilities.
Three Featured Product Series Addressing IoT Hardware Commercialization Challenges
1. BC Series Broadband Conical Inductors: Designed for Full-Band LoRaWAN Gateways
LoRaWAN gateways are required to support Sub-GHz frequency bands such as 868 MHz and 915 MHz, while increasingly integrating 2.4 GHz communications. This places stringent requirements on broadband impedance matching performance.
Shinhom's BC Series Conical Inductors operate across an ultra-wide frequency range of 10 MHz to 40 GHz, delivering low insertion loss and excellent voltage standing wave ratio (VSWR) characteristics. These inductors are suitable for RF front-end circuits, filtering networks, and isolation applications within gateway architectures. Their surface-mount package design also facilitates compact PCB layouts.
2. Flat-Wire Power Inductors: Supporting Transient Power Demands in Edge AI Systems
Edge AI gateways and industrial controllers frequently experience high transient current pulses during computational workloads, conditions under which conventional round-wire inductors may be susceptible to magnetic saturation.
Shinhom's Flat-Wire Power Inductors employ flattened copper windings that increase effective heat dissipation area by approximately 40–60% compared with traditional round-wire designs, thereby reducing skin-effect losses. Their tightly arranged winding structure improves thermal efficiency by more than 30%, enabling stable operation across a temperature range of −40°C to +125°C. With power ratings spanning from tens of watts to several kilowatts, these inductors are well suited for DC-DC power conversion circuits in edge computing applications.
3. Planar Transformers: Optimized for GaN-Based High-Frequency Isolated Power Supplies
The adoption of GaN technology has accelerated the miniaturization of IoT power adapters and power modules. To address this trend, Shinhom has developed a proprietary Planar Transformer utilizing a PCB-stacked winding architecture combined with a planar magnetic core.
This design reduces overall volume to approximately one-third that of conventional wound transformers. Leakage inductance is controlled to within 0.2% of primary inductance, while power conversion efficiency reaches 98–99%. The product is currently supplied in volume for applications including industrial sensor isolation power supplies, smart metering communication modules, and smart home gateways.
Technical Discussions Focused on Key Industry Priorities
During the three-day exhibition, Shinhom's engineering team engaged with IoT integrators and hardware manufacturers from Europe, North America, and the Middle East, discussing practical solutions to several pressing industry concerns:
- Power optimization for LPWAN sensor devices: Enhancing battery life in water meters, temperature sensors, and similar devices through improved DC bias characteristics and reduced no-load losses in inductive components.
- EMI mitigation in harsh industrial environments: Employing toroidal-core inductors to suppress common-mode interference generated by motors, variable-frequency drives, and other high-noise equipment.
- RF miniaturization and multi-band integration: Supporting the industry-wide transition toward integrated multi-band RF systems through continued reductions in magnetic component size, thickness, and PCB footprint.
Numerous R&D engineers requested samples of the BC Series Broadband Inductors and Flat-Wire Power Inductors for subsequent evaluation and testing. Information regarding sample requests and technical collaboration opportunities was distributed through exhibition materials and follow-up business communications.
Expanding Global Engagement Through International Exhibitions
For Shinhom, IOTSWC 2025 served not only as a platform for product demonstration but also as a strategic opportunity to strengthen international partnerships and gain deeper insight into evolving market requirements.
Through direct engagement with industry stakeholders, the company further identified global demand for customized magnetic component solutions in areas such as power management, RF signal processing, and compact system integration. Moving forward, Shinhom plans to continue advancing its magnetic component technologies to provide reliable and scalable solutions for IoT hardware manufacturers worldwide.
Sample Requests and Technical Consultation
Organizations currently developing LoRaWAN gateways, edge AI hardware, industrial wireless sensors, or smart metering systems may request product samples or schedule technical evaluations through the following channels:
📧 邮箱： sales@shinhom.com
🌐 官网： www.shinhom.com
📞 电话： +86-29-87851838