Extreme ultraviolet (EUV) lithography has become pivotal in producing smaller, more powerful microchips. The industry is transitioning to high numerical aperture (High NA) EUV systems, which offer a numerical aperture of 0.55 compared to the standard 0.33 NA. This advancement enables finer patterning without relying on complex multi-patterning techniques, positioning High NA EUV as essential for next-generation microprocessors, memory chips, and advanced components.
Breakthrough in Resolution
ASML recently demonstrated a milestone by printing 10 nm dense lines-the smallest ever achieved-using its High NA EUV scanner in Veldhoven, Netherlands. This achievement followed initial calibration of the system's optics, sensors, and stages. The ability to produce such high-resolution patterns marks significant progress toward commercial deployment, potentially accelerating chip miniaturization.
Early Industry Adoption
Intel Foundry, Intel's manufacturing arm, became the first to assemble ASML's commercial High NA EUV tool at its Oregon facility. The scanner aims to enhance precision and scalability for AI-focused semiconductors and future technologies. Intel plans to integrate two High NA systems into its 18A node by 2025, with additional units slated for its 14A node in the 2030s. Reports indicate Intel has ordered five scanners from ASML.
Meanwhile, TSMC is expected to install its first High NA EUV tool in 2025, prioritizing R&D before mass production later in the decade. Despite the high cost (~$350 million per unit), ASML's limited sales (seven units sold recently) reflect strategic adoption. Analysts predict installations will surge post-2025, with 10–20 orders anticipated by mid-decade.
Collaborative Innovations
While ASML remains the sole High NA EUV supplier, partnerships are critical for optimizing its use. Carl Zeiss SMT developed advanced optics for ASML's scanners, including larger mirrors to harness increased light capture. The High NA optical system comprises 25,000 components, with projection optics weighing 12 tons and illumination systems at 6 tons. These enhancements enable nanometer-level precision for sub-10 nm chip features.
Belgium's imec recently gained access to ASML's full tool suite to explore sub-2 nm processes, silicon photonics, and advanced packaging. The two organizations also launched a joint lab in Veldhoven, offering chipmakers early exposure to prototype scanners. Key research areas include:
Novel resist/underlayer materials
High-accuracy photomasks
Metrology/inspection methods
Imaging optimization
Etch techniques and proximity correction
Market Outlook
High NA EUV adoption aligns with the semiconductor industry's push toward angstrom-scale nodes. Though initial costs and technical challenges remain, the technology's resolution advantages are expected to drive widespread adoption by late 2025. As Intel, TSMC, and others integrate these systems, High NA EUV is poised to redefine chip manufacturing for AI, HPC, and beyond.