1. Why Magnetic Cores Limit Ignition Performance
Traditional ignition transformers hit a wall at 150mJ per pulse. Why?
Core losses: Ferrite cores suffer 60% higher eddy losses above 100kHz, wasting energy as heat
Saturation risk: Silicon steel cores lose 40% inductance under DC bias, causing unstable arcs
Size penalty: Magnetic cores occupy >50% volume in 30kV igniters
The solution? Eliminate the core entirely.
2. GaN + Coreless Synergy: The 220mJ Breakthrough
Structural Innovation
Layer | Material | Function |
---|---|---|
Insulation | SiO₂ nano-coating | Withstands >30kV/mm, stops arcing |
Conductor | Cu foil + Ag sintering | Reduces skin effect (↓40% impedance) |
Encapsulation | Epoxy + BN filler | Thermal conductivity >5W/mK |
Key tech: SP-P magnetic resonance enables direct capacitor-coil energy transfer
GaN Integration Advantages
2MHz switching: Arc formation time <50ns (vs. 200ns for silicon)
Zero Qrr loss: Eliminates reverse recovery distortion (pulse distortion <2%)
Monolithic design: Driver + GaN HEMT + protection in one package (70% size reduction)
3. Power Density Blueprint: From 150mJ to 220mJ
Multi-stage Energy Compression
Critical components:
Ceramic stacked capacitors: ESR <1mΩ
dV/dt >150V/ns switching (e.g., TI LMG3522)
Thermal-Electric Co-Design
Dual-side cooling: Top copper pillars + bottom AlSiC substrate (thermal resistance <0.5°C/W)
Pulse thermal model:
ΔT=Epulse⋅frepCthΔT=CthEpulse⋅frep
At 220mJ/100Hz: ΔT <15°C with BN-epoxy encapsulation
4. Real-World Impact: Hydrogen Engines & Industrial Burners
Metric | Silicon Core | GaN Coreless | Improvement |
---|---|---|---|
Single-pulse energy | 150mJ | 220mJ | +46.7% |
Volume | 120cm³ | 45cm³ | -62.5% |
Ignition success rate (-40°C) | 89% | 99.9% | ↑10.9 pts |
Industrial case: Natural gas burner using coreless modules:
CO emissions ↓15% (leaner combustion)
Maintenance costs ↓40% (no core aging)
5. Overcoming Production Challenges
Challenge | Solution | Result |
---|---|---|
High-voltage arcing | Al₂O₃ vapor deposition | Withstands 50kV |
EMI at 30MHz | Triple shielding: Nano-crystal/Cu mesh/metalized plastic | Noise ↓20dBμV |
Sintering voids | Ag paste + vacuum reflow | Void rate <5% |