Slim Transformers, Big Savings: 35% Cost Cut With Unencapsulated Planar Transformers in SMT Lines

💰 The 35% Cost-Saving Blueprint

Unencapsulated transformers outperform encapsulated rivals in three key areas:

Material cost elimination:

No epoxy housing → ¥18.5/unit saved

Direct PCB thermal coupling → heat sink area reduced 40% (saves ¥7.8/unit) 

Logistics optimization:

60% smaller volume → warehouse space cut by ¥3.5/unit

Labor cost reduction:

SMT direct mounting → eliminates ¥6.2/unit post-assembly labor 

Real-world impact: A 10kW solar inverter project saved 29% system costs by switching to unencapsulated PQ cores with 2oz copper foil .

⚙️ SMT Direct-Mount Process Controls

1. Pre-Production Critical Checks

2. Patented Glue Dispensing Rules

Prevents 92% of placement shifts during reflow 

3. Height Compensation System

Laser altimeters monitor Z-axis (±5μm precision)

Automatic nozzle adjustment:

If core height > nominal → nozzle presses 0.05mm
Else → standard placement

Result: Drop rate ↓30% vs. encapsulated units

🔥 Reflow Soldering: 3 Critical Upgrades

Gentler temperature ramp:

Max slope ≤2°C/sec (vs. industry standard 3°C/sec)

Why? Prevents epoxy cracking in unshielded cores

Lower peak temperature:

245±3°C (10°C below encapsulated transformers)

Nitrogen atmosphere:

O₂ <800ppm → solder joint oxidation ↓50% 

⚠️ Must-do validation: X-ray alignment check (winding offset <10%)

📊 First-Pass Yield Boosting Tools

Stencil Design Optimization

Real-Time OEE Dashboard

Track three metrics simultaneously:

Time efficiency >85%

Performance rate >95%

Yield rate >99%

Pro tip: Integrate RFID feeders to eliminate wrong material loading

⚡ Case Study: Solar Inverter Maker

Challenge: 82% first-pass yield with encapsulated transformers

Solution:

Adopted unencapsulated PQ cores (2oz copper)

Implemented glue dispensing patent CN118973136A

Results:

98.5% first-pass yield

50% higher throughput (eliminated post-SMT assembly)

29% system cost reduction